Download the pattern to apply on Vincotech modules 

Applying thermal interface material is unavoidable to guarantee a good thermal coupling between the power module and the heatsink. The material provides an extremely long stability, which is the most important characteristic. Especially modules with convex pre-bent lower-surfaces support this requirement.

To assure the best thermal resistance a specific amount of thermal interface material is essential. Therefore, Vincotech offers for each power module a recommended TIM pattern, which can be downloaded below.

Pattern for Vincotech modules 

Use the below table and download the thermal interface material pattern of choice.
Patterns have been tested with thermal interface material Wacker P12.

dxf files of recommended TIM pattern
Module Minimum / µm Typical / µm Maximum / µm dxf file
flow 0B 40 55 70 flow 0B pattern
flow 0 30 55 80 flow 0 pattern
flow 1B 70 99 110 flow 1B pattern
flow 1C 70 90 110 flow 1C pattern
flow 1 Al2O3 30 50 80 flow 1 pattern
flow 1 AlN 30 50 60 flow 1 pattern
flow 2 80 110 140 flow 2 pattern
flow90 0 35 60 85 flow90 0 pattern
flow90 1 45 70 95 flow90 1 pattern
flow E1 45 55 65 flow E1 pattern
flow E2 45 55 65 flow E2 pattern
VINco X 115 140 160 VINcoX pattern
MiniSKiiP® 0 40 55 70 MiniSKiiP® 0 pattern
MiniSKiiP® 1 50 70 90 MiniSKiiP® 1 pattern
MiniSKiiP® 2 60 75 90 MiniSKiiP® 2 pattern
MiniSKiiP® 3 80 95 110 MiniSKiiP® 3 pattern
VINco E3 100 120 140 VINco E3 pattern
Related Information
Document Name Type Date Download
Thermal interface material Application Note 2013-10 PDF
Power Modules with Phase-Change Material Application Note 2012-07 PDF
Thermal interface material Video
Application of thermal grease Video