For 10+ years Vincotech offers MiniSKiiP® modules with solderless spring contact mounting technology and pre-applied thermal paste. These second-source modules are affixed with SPRiNG contacts and just a single screw to create electrical and thermal connections and make assembly an exercise in convenience. There is no need for time-consuming, costly mounting procedures, and even entire modules are easy to replace with SPRiNG contacts should the need arise.

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Housing dimensions 

  • Height: 16 mm
  • Length: 34 mm
  • Width: 31 mm

Thermal interface material options

  • Silicone-based standard grease Wacker P12
  • Silicone-free standard grease Thermigrease® TG20032
  • High Performance Thermal Paste - HPTP (silicone-based)

Lids 

Two lids are available for all MiniSKiiP® modules:

  • The standard black 6.5 mm version accommodates SMD parts to be mounted below the lid
  • The thin, white 2.8 mm version is sized for highly compact mechanical designs
Thermal grease options Lid Order code
Without thermal grease Standard (6.5 mm) - /0A/
Without thermal grease Thin (2.8 mm) - /0B/
Silicone-based standard grease - Wacker® P12 Standard (6.5 mm) - /1A/
Silicone-based standard grease - Wacker® P12 Thin (2.8 mm) - /1B/
Silicone-free standard grease - Thermigrease® TG 20032 / silicone-free Standard (6.5 mm) - /4A/
Silicone-free standard grease - Thermigrease® TG 20032 / silicone-free Thin (2.8 mm) - /4B/
High Performance Thermal Paste - HPTP (silicone-based) Standard (6.5 mm) - /5A/
High Performance Thermal Paste - HPTP (silicone-based) Thin (2.8 mm) - /5B/

Order codes

Example order code for different lids and applied grease:

  • Version 1: V23990-K220-A40-/1A/-PM
  • Version 2: 80-M206BIA045fH-K999E10-/1A/

Outline drawing 

Housing dimension MiniSKiiP 0
SkiiP 0 CD