VINco X8

242.5 mm x 129.2 mm

Package Picture

Possible features

  • Optimized for three-level topologies
  • Enables high switching frequencies
  • Low inductive package
  • Easy paralleling
  • Optimal current sharing
  • Thermo-mechanical push-and-pull force relief
  • M6 High Power Screw Contact
  • M4 Low Inductive Interface
  • Press-fit connection to driver PCB
More about VINco X8
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      • Voltage
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          in A
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        • Main Chip technology
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            in mm
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            Part-no details / Part-no datasheet Product status Topology Sub-Topology Product line Voltage

            in V            		 Current

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            mm            		 Isolation Simulation  
            70-W424NIA800SH-M800F Module datasheet: Series production Three-level NPC (I-Type) NPC-KE-DC snubber diode-DC-NTC VINcoNPC X8 1200 800 IGBT4 HS VINco X8 Al2O3 Request simulation
            70-W424NIA800M7-M800F70 Module datasheet: Series production Three-level NPC (I-Type) NPC-KE-DC snubber diode-DC-NTC VINcoNPC X8 1200 800 IGBT M7 VINco X8 Al2O3 Request simulation
            70-W424NIA1K2M702-LD07FP70 Module datasheet: In qualification Three-level NPC (I-Type) NPC-KE-NTC VINcoNPC X8 1200 1200 IGBT M7 VINco X8 Al2O3 Simulate this module
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