VINco X8

242.5 mm x 129.2 mm

Package Picture

Possible features

  • Easy paralleling
  • Low inductive package
  • Low inductive transient interface
  • Optimal current sharing
  • Optimized for three-level topologies
  • M4 Low Inductive Interface
  • M6 High Power Screw Contact
  • No PCB hole damage to enable reuse
  • Reliable cold welding connection to PCB
  • Thermo-mechanical push-and-pull force relief
More about VINco X8
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  • Voltage
    in V
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    in A
  • Main Chip technology
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    in mm
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Isolation Module datasheet  
70-W424NIA800SH-M800F Series production Three-level NPC (I-Type) NPC-KE-DC snubber diode-DC-NTC VINcoNPC X8 2400 800 IGBT4 HS VINco X8 Al2O3 Module datasheet:PDF
NPC-KE-DC snubber diode-DC-NTC
VINcoNPC X8
70-W424NIA1K2M702-LD07FP70 In qualification Three-level NPC (I-Type) NPC-KE-NTC VINcoNPC X8 2400 1200 IGBT M7 VINco X8 Al2O3 Module datasheet:PDF
NPC-KE-NTC
VINcoNPC X8