VINco X8

242.5 mm x 129.2 mm

Package Picture

Possible features

  • Optimized for three-level topologies
  • Enables high switching frequencies
  • Low inductive package
  • Easy paralleling
  • Optimal current sharing
  • Thermo-mechanical push-and-pull force relief
  • M6 High Power Screw Contact
  • M4 Low Inductive Interface
  • Press-fit connection to driver PCB
More about VINco X8
  • Topology
  • Sub-Topology
  • Product line
  • Voltage
    in V
  • Current
    in A
  • Main Chip technology
  • Height
    in mm
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Part-no details / Part-no datasheet Product status Topology Sub-Topology Product line Voltage

in V
Current

in A
Main Chip technology Housing family Height in

mm
Isolation Simulation  
70-W424NIA800SH-M800F Module datasheet: Series production Three-level NPC (I-Type) NPC-KE-DC snubber diode-DC-NTC VINcoNPC X8 1500 800 IGBT4 HS VINco X8 Al2O3
70-W424NIA800M7-M800F70 Module datasheet: Series production Three-level NPC (I-Type) NPC-KE-DC snubber diode-DC-NTC VINcoNPC X8 1500 800 IGBT M7 VINco X8 Al2O3
70-W424NIA1K2M702-LD07FP70 Module datasheet: In qualification Three-level NPC (I-Type) NPC-KE-NTC VINcoNPC X8 1500 1200 IGBT M7 VINco X8 Al2O3
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