flow E3

109.9 x 62 mm

Package Picture

Possible features

  • CTI600 housing material
  • Compact, baseplate-less housing
  • VINcoPress Technology
  • Thermo-mechanical push-and-pull force relief
  • Press-fit pin
  • Reliable cold welding connection
  • Topology
  • Sub-Topology
  • Product line
  • Voltage
    in V
  • Current
    in A
  • Main Chip technology
  • Height
    in mm
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Part-no details / Part-no datasheet Product status Topology Sub-Topology Product line Voltage

in V
Current

in A
Main Chip technology Housing family Height in

mm
Isolation Simulation  
B0-EP12PMA100M7-PE89A68T Module datasheet: In qualification PIM (CIB) CIB-OE-KE-NTC flowPIM® E3 1200 100 IGBT M7 flow E3 12 Al2O3
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