flow E3
109.9 x 62 mm
Possible features
- CTI600 housing material
- Compact, baseplate-less housing
- VINcoPress Technology
- Thermo-mechanical push-and-pull force relief
- Press-fit pin
- Reliable cold welding connection
- Topology
- Sub-Topology
-
Product line
-
Voltage
in V -
Current
in A -
Main Chip technology
-
Height
in mm
| Part-no details / Part-no datasheet | Product status | Topology | Sub-Topology | Product line | Voltage in V |
Current in A |
Main Chip technology | Housing family | Height in mm |
Isolation | Simulation | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
B0- |
In qualification | PIM (CIB) | CIB-OE-KE-NTC | flowPIM® E3 | 1200 | 100 | IGBT M7 | flow E3 | 12 | Al2O3 | Simulate this module |
|
|