Product News

Vincotech Adds flow E1/E2 Product Family

The new flow E1/E2 product family, including PIM (flowPIM E1/E2) and sixpack (flowPACK E1/E2) configurations, features the latest chip generations and deliver superior thermal performance.

flow E2 + flow E1
flow E2+ flow E1

The new 12 mm flow E1/E2 packages for motion control applications go to augment an offering that already includes PIM (flowPIM E1/E2) and sixpack (flowPACK E1/E2) configurations for 600 V and 1200 V with extended power ranges up to 100 A. With these new power modules in a very compact design, featuring the latest IGBT4 and IGBT M7 chip technologies, your will enjoy enhanced efficiency, a greater supply chain security and even more options for building the best in high-performance inverters.


  • 12 mm low-inductive standard industrial package
  • Pre-bent DCB for excellent thermal contact to heat sink
  • Press-fit pins with stress-relive zone
  • Optional Phase-change material


  • 20% thermal performance (Rthj-s) improvement compared to competition for increased lifetime,  higher power and reliability
  • 30% higher power density with latest generation  IGBT M7 chip technology
  • Real multiple source down to chip level (IGBT4, IGBT M7) for enhanced  supply chain security
  • Easy assembly with pre-applied phase-change  material and Press-fit pinsSuperior thermal performance for longer lifetime, higher power and greater reliability

To learn more about the new about our flow E product family, please visit

flow E1 & flow E2 product range

Samples of the flow E1 and flow E2 are available through our usual channels.

To see the currently available products and select the best module for your application, visit: