Product News

Reliability meets flexibility

 

MiniSKiiP®DUAL with advanced NEW die-attach technology

 

Manufacturers expect more from power modules these days. Extended operating time at high temperatures is a top priority. VIN’s advanced new die-attach technology strengthens the bond between chips and DCBs to live up to those expectations all across the MiniSKiiP® product line.

Featuring latest-generation IGBT M7 and IGBT7 chips, Vincotech MiniSKiiP® DUAL products deliver the triple-play benefits of superior performance, multiple sourcing and longer life for flexible and scalable inverter designs with nominal currents up to 400 A.

 

Samples of the MiniSKiiP® with IGBT7 or IGBT M7 are available through our usual channels. 

 

Main benefits

  • More than ten times longer life at high operating temperatures
  • Latest-gen chips up efficiency and power density to help drive down system costs
  • Less material usage (rather than copper bus bars) plus easy, solder-free assembly equals even greater savings