Silicon nitride
Remarkable mechanical strength, superior toughness, and high thermal conductivity make silicon nitride substrates the material of choice for power modules designed for ultra reliable products.
Features
- High thermal conductivity (four times that of Al2O3)
- 50 % lower Rth for MiniSKiiP® (incl. thermal interface material)
- Physically robust enough for high-performance thermal interface material
- Phase-change with 3.4 W/mK to be used to expedite module assembly and handling
- Lower thermal expansion rates for improved load power cycling capability
Silicon nitride
Remarkable mechanical strength, superior toughness, and high thermal conductivity make silicon nitride substrates the material of choice for power modules designed for ultra reliable products.
Features
- High thermal conductivity (four times that of Al2O3)
- 50 % lower Rth for MiniSKiiP® (incl. thermal interface material)
- Physically robust enough for high-performance thermal interface material
- Phase-change with 3.4 W/mK to be used to expedite module assembly and handling
- Lower thermal expansion rates for improved load power cycling capability