VINco E3
122 mm x 62 mm
Possible features
- SoLid Cover Technology
- Standard mid-power industry package
- Avaliable with press-fit and solder-pin
- Tin plated solder pin terminals
- Reliable cold welding connection to PCB
- Press-fit terminals
- Topology
- Sub-Topology
-
Product line
-
Voltage
in V -
Current
in A -
Main Chip technology
-
Height
in mm
| Part-no details / Part-no datasheet | Product status | Topology | Sub-Topology | Product line | Voltage in V |
Current in A |
Main Chip technology | Housing family | Height in mm |
Isolation | Simulation | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A0- |
Series production | Sixpack | Inverter-KE-NTC | VINcoPACK E3 | 1200 | 100 | IGBT M7 | VINco E3 | 17 | IMB | Simulate this module |
|
|
|
A0- |
Series production | Sixpack | Inverter-KE-NTC | VINcoPACK E3 | 1200 | 150 | IGBT M7 | VINco E3 | 17 | IMB | Simulate this module |
|
|
|
A0- |
Series production | Sixpack | Inverter-KE-NTC | VINcoPACK E3 | 1200 | 200 | IGBT M7 | VINco E3 | 17 | IMB | Simulate this module |
|
|
|
A0- |
Series production | Sixpack | Inverter-KE-Tandem Diode-NTC | VINcoPACK E3 | 1200 | 200 | IGBT4 HS | VINco E3 | 17 | IMB | Simulate this module |
|
|
|
A0- |
Series production | Sixpack | Inverter-KE-Tandem Diode-NTC | VINcoPACK E3 | 1200 | 200 | IGBT4 HS | VINco E3 | 17 | IMB | Simulate this module |
|
|
|
A0- |
Series production | Sixpack | Inverter-KE-NTC | VINcoPACK E3 | 1200 | 100 | IGBT M7 | VINco E3 | 17 | IMB | Simulate this module |
|
|
|
A0- |
Series production | Sixpack | Inverter-KE-NTC | VINcoPACK E3 | 1200 | 150 | IGBT M7 | VINco E3 | 17 | IMB | Simulate this module |
|
|
|
A0- |
Series production | Sixpack | Inverter-KE-NTC | VINcoPACK E3 | 1200 | 200 | IGBT M7 | VINco E3 | 17 | IMB | Simulate this module |
|
|