flow 1B

72 mm x 36 mm

Package Picture

Possible features

  • Ceramic substrate for Thick-film based designs
  • Convex shaped substrate for superior thermal contact
  • Thermo-mechanical push-and-pull force relief
  • Solder pin
  • Press-fit pin
  • Reliable cold welding connection
More about flow 1B
  • Topology
  • Sub-Topology
  • Product line
  • Voltage
    in V
  • Current
    in A
  • Main Chip technology
  • Height
    in mm
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Part-no details / Part-no datasheet Product status Topology Sub-Topology Product line Voltage

in V
Current

in A
Main Chip technology Housing family Height

in mm
Isolation Simulation  
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