flow 1B

72 mm x 36 mm

Package Picture

Possible features

  • Ceramic substrate for Thick-film based designs
  • Thermo-mechanical push-and-pull force relief
  • Reliable cold welding connection to PCB
  • No PCB hole damage to enable reuse
More about flow 1B
  • Topology
  • Sub-Topology
  • Product line
  • Voltage
    in V
  • Current
    in A
  • Main Chip technology
  • Height
    in mm
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Part-no details / Part-no datasheet Product status Topology Sub-Topology Product line Voltage

in V
Current

in A
Main Chip technology Housing family Height in

mm
Isolation Simulation  
20-1B12IPA008SC-L239C09 Module datasheet: Series production IPM (CIB) CIB-OE-NTC flowIPM 1B (CI) 1200 8 IGBT4 flow 1B 17 Al2O3
20-1B06IPB010RC02-L815A49 Module datasheet: Series production IPM (CIP/PIM+PFC) CIP-NTC flowIPM 1B (CIP) 600 10 IGBT RC flow 1B 17 Al2O3
20-1B06IPB010RC01-P955A45 Module datasheet: Series production IPM (CIP/PIM+PFC) CIP-NTC flowIPM 1B (CIP) 600 10 IGBT RC flow 1B 17 Al2O3
20-FB12IPA008SC-L239C08Y Module datasheet: Series production IPM (CIB) CIB-OE-NTC flowIPM 1B (CI) 1200 8 IGBT4 flow 1B 12 Al2O3
20-1B12IPA015SC-L579F09 Module datasheet: In qualification IPM (CIB) CIB-OE-NTC flowIPM 1B (CI) 1200 15 IGBT4 flow 1B 17 Al2O3
20-1B06IPB010RC03-P955A65 Module datasheet: Series production IPM (CIP/PIM+PFC) CIP-NTC flowIPM 1B (CIP) 600 10 IGBT RC flow 1B 17 Al2O3
20-1B06IPB004RC-P952A40 Module datasheet: Series production IPM (CIP/PIM+PFC) CIP-NTC flowIPM 1B (CIP) 600 4 IGBT RC flow 1B 17 Al2O3
20-1B06IPB010RC-P955A40 Module datasheet: Series production IPM (CIP/PIM+PFC) CIP-NTC flowIPM 1B (CIP) 600 10 IGBT RC flow 1B 17 Al2O3
20-1B06IPB004RC01-P952A45 Module datasheet: Series production IPM (CIP/PIM+PFC) CIP-NTC flowIPM 1B (CIP) 600 4 IGBT RC flow 1B 17 Al2O3
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