Built on the proven flow 2 and flow E3BP platforms, Vincotech’s new flow E3BP+ baseplate module introduces major system‑level gains through module‑level innovation. It features Si₃N₄ substrate for improved mechanical and thermal reliability, along with high‑temperature operation up to 175 °C.
These advancements significantly increase power density and long‑term durability, making the module a perfect fit for next‑generation PV and PCS applications.