Product News

PACKAGED TO MEET YOUR MID-POWER NEEDS

 

Out now: VINco E3, the new low-profile package for motion control, solar and UPS applications

 

VINco E3
VINco E3

Engineered mainly for industrial drives, solar power and UPS applications, the VINco E3 package raises the performance bar with its enhanced power density and reliability.

Featuring the SLC (SoLid Cover) technology in the industry-standard low-profile package, Vincotech’s new VINco E3 package enables engineers to design mid-power inverters with higher output current, higher power density and improved reliability for industrial drives, solar power, UPS and other applications.

The IMB (Insulated Metal Baseplate) combines an electrically insulating resin layer with a direct-bonded top- and bottom-side copper layer. It replaces the substrate solder layer and separate baseplate to achieve:

  •  High thermal cycling capability
  •  Reduced thermal resistance
  •  High power density and low stray inductance

Direct potting resin distributes the mechanical stress more uniformly than silicone gel for:

  • Improved power cycling capability

 

 

Comparison SLC with conventional technology
Comparison SLC with conventional technology
Direct potting resin

Main Features:

  • Low-loss, Mitsubishi gen 7 or Trech IGBT4 chip technology
  • Extended module life-time
  • Industry-standard, low-profile package
  • Built-in NTC
  • Scalable product platform

 

The new VINco E3 will first be released in a half-bridge configuration, with the six-pack and PIM configurations to follow.

 

 

VINco E3 - Line-up:

 

Topology VCES
650 V
VCES
1200 V
VCES
1700 V
Chip Technology
Half-Bridge 300 300* 300 Mitsubishi gen 7   or   Trench IGBT4
Half-Bridge 450 450* 450 Mitsubishi gen 7   or   Trench IGBT4
Half-Bridge 600 600* 600 Mitsubishi gen 7   or   Trench IGBT4
Half-Bridge   690*   Mitsubishi gen 7
Sixpack 100 100 100 Mitsubishi gen 7   or   Trench IGBT4
Sixpack 150 150 150 Mitsubishi gen 7   or   Trench IGBT4
Sixpack 200 200   Mitsubishi gen 7   or   Trench IGBT4
  under development
* engineering samples available
 

First engineering samples may be sourced on demand from our usual channels.

Press Release