New flowANPC S3 split
Featuring 950 V fast Si IGBTs and 1200 V SiC diodes, the new 600 A, 300+ kVA flowANPC S3 is ready to up your multi-string inverters‘ power density and performance. The chipset is optimized for a maximum efficiency at high power factors, enhancing the performance in inverter operation. With Vincotech's new flow S3 mid-power packages, the LQ79/89 enables smaller and therefore lighter passive components, and combined with the advanced die attach technology, longer lifetime is now possible. Soaking up the power of the sun while cutting the cost per kW and maximizing your customers‘ ROI has never been easier.
- 300+ kVA for higher power density, lower cost
- Optimized chipset for greater efficiency, better ROI
- flow S3 mid-power package for smaller, lighter passive components
- Advanced die attach techology for longer lifetime or higher power from the same footprint
Samples of the flowANPC S3 Split modules are available through our usual channels.