Engineered for maximum power density, this half-bridge module can serve to construct excellent H-bridges and sixpacks. Far higher current handling, enhanced power loss dissipation, greater scalability than a solution with a single-module footprint – the flowDUAL delivers all this and more.
In combination with VINcoPress and advanced die-attach technology, this new baseplate-less module is your first choice for a wide range of high-power use cases where utmost efficiency and reliability are top priorities.
Find more about the technical details in the product page.
Samples are available through our usual channels.