Product News


VINcoNPC X12 featuring Mitsubishi 1200 V gen 7 chips for 1500 V DC-link applications up to 1 MW

Housed in a low-inductive package, this neutral-point clamped module’s superior design comes with many benefits: Connections are optimized for three-level topologies simplifying the busbar design. The symmetrical layout serves to share current uniformly and distribute temperature evenly to extend component life. The outstanding power density and efficiency enables more compact designs.

Read more about VINcoNPC X12.

Samples may be sourced on demand from our usual channels.



Main benefits

  • Up to 1 MW at 99 % efficiency without paralleling modules
  • Enhances three-level topologies’ benefits and reduces design effort
  • Fully symmetrical layouts for better current distribution and higher reliability
  • Now available with phase-change thermal interface material



  • Solar
  • UPS