Vincotech has been offering pre-applied thermal paste on power modules for many years. This service offers additional benefits with regards to performance and reliability. The screen-printing process is very accurate, so the material’s thickness is well defined and can be optimized for maximum heat transfer capability. For silicone-sensitive applications a new silicone-free thermal paste has been qualified and released for MiniSKiiP® power modules.
- Thermal conducting material with optimized thickness
- Optimized thermal resistance
- Easier production process; no need for screen printing facilities
- Automated screen printing for utmost precision and reliability
- For silicone-sensitive applications also available in the newly approved silicone-free TIM
|Wacker® Paste P12||0.81||silicone-based|
|Müller-Ahlhorn Thermigrease® TG 20032||2.5||silicone-free|