Phase-Change Material

The benefits of using Loctite® PowerstrateXtremeTM (PSX) phase-change material to enable thermal conductivity between the module and heat sink are considerable. The phase-change material is solid at room temperature. This makes it smear resistant during transportation and module assembly. Our in-house screen-printing process ensures the material’s thickness configured and optimized for maximum heat transfer capability. The phase-change material is released for all flow housings with and w/o baseplate in combination with Al2O3 DCB, but also for MiniSKiiP® with Si3N4 DCB.


    • Solid, non-sticky surface; minimizes contamination risk, prevents layer damage
    • Fast, easy assembly of modules
    • Easier production process; no need for screen printing facilities
    • Automated screen printing for utmost precision and reliability
    • Low thermal resistance with optimized thickness
    • Four times higher thermal conductivity than standard thermal grease


        • Up to 20 % Rth reduction from Tj to heat sink for Al2O3-based modules
        • Up to 30 % Rth reduction from Tj to heat sink for AlN-based high performance modules
        • More output power or longer lifetime
        • Standard solder profile applicable (e.g. J-STD-001, J-STD-003)
        • Compatible with Press-fit pins


          Value Unit

          Specific gravity

          2 g/cm²

          Thermal conductivity

          3.4 W/m*K

          Phase change temperature

          +45 °C

          Viscosity above phase-change temperature


          Protection of thermal interface material

          ProCap 0 and ProCap 1

          To protect the thermal interface material during transport of modules or in a wave-soldering oven, Vincotech has developed ProCaps (protection caps) for during and after PCB assembly.