The benefits of using Loctite® PowerstrateXtremeTM (PSX) phase-change material to enable thermal conductivity between the module and heat sink are considerable. The phase-change material is solid at room temperature. This makes it smear resistant during transportation and module assembly. Our in-house screen-printing process ensures the material’s thickness configured and optimized for maximum heat transfer capability. The phase-change material is released for all flow housings with and w/o baseplate in combination with Al2O3 DCB, but also for MiniSKiiP® with Si3N4 DCB.
Easier production process; no need for screen printing facilities
Automated screen printing for utmost precision and reliability
Low thermal resistance with optimized thickness
Four times higher thermal conductivity than standard thermal grease
Up to 20 % Rth reduction from Tj to heat sink for Al2O3-based modules
Up to 30 % Rth reduction from Tj to heat sink for AlN-based high performance modules
More output power or longer lifetime
Standard solder profile applicable (e.g. J-STD-001, J-STD-003)
Compatible with Press-fit pins
Phase change temperature
Viscosity above phase-change temperature
Protection of thermal interface material
ProCap 0 and ProCap 1
To protect the thermal interface material during transport of modules or in a wave-soldering oven, Vincotech has developed ProCaps (protection caps) for during and after PCB assembly.