The benefits of using phase-change material to enable thermal conductivity between the module and heat sink are considerable. The phase-change material is solid at room temperature. This makes it smear resistant during transportation and module assembly. Our in-house screen-printing process ensures the material’s thickness configured and optimized for maximum heat transfer capability.


  • Up to 20 % Rth reduction from Tj to heat sink for Al2O3-based modules
  • Up to 30 % Rth reduction from Tj to heat sink for AlN-based high performance modules
  • Solid, non-sticky surface – minimizes contamination risk, prevents layer damage


  • Fast, easy assembly of modules
  • Thermal conducting material with optimized thickness
  • Four times higher thermal conductivity and significantly lower thermal
  • resistance than standard grease
  • Better Rth and reduced risk of DCB cracking
  • Easier production process; no need for screen printing facilities
  • Automated screen printing for utmost precision and reliability
  • No risk of smearing thermal paste; material is solid at room temperature
  • Non-stick surface, resistant


Parameter Value Unit
Thermal conductivity 3.4 W/m*K
Phase change temperature +45 °C