Vincotech Logo Vincotech Logo
  • English
  • Chinese
  • 产品信息
    产品搜索
    • 所有产品
    • 根据拓扑查询
    • 根据封装查询
    • 根据应用查询
    功率模块
    • Rectifier (+Brake)
    • Ultrafast Rectifier
    • Half-Bridge
    • H-Bridge
    • Sixpack
    • Sevenpack
    • PIM+PFC (CIP)
    • PIM+3xPFC (CIP)
    • PIM (CIB)
    • Twin Inverters
    • IPM (CIB)
    • IPM (CIP/PIM+PFC)
    • Booster
    • Booster Symmetric
    • Three-level FC Booster
    • Buck-Booster Symmetric
    • Three-level MNPC (T-Type)
    • Three-level NPC (I-Type)
    • Three-level ANPC
    • Three-level FC Inverter
    • H6.5
    • Single Phase Inverter
    • PFC (Single-phase applications)
    • PFC (Three-phase applications)
    电阻器
    • Brake Resistors
    • Inrush Resistors

    继电器
    • Solid State Relays (SSR)
  • 应用与支持
    • 技术库
    • 封装尺寸/操作说明
    • 评估板 /参考设计
    • 仿真软件
    • 参考设计
    • 证书
    • 申请样品
    • Product Naming
    • Vincotech Glossary
    • Cross Reference
    • Thermistor Reference
  • 技术与创新
    • VINcoPress Technology
    • 高级基底材料 - AlN
    • 高级基底材料 - Si₃N₄
    • Advanced Die-Attach Technology
    • Thermal Paste / Thermal Grease for Power Modules
    • Thermal grease pattern
    • Protection of thermal interface material - ProCap
    • 压接技术
    • Press-in Tools
    • Advanced Semiconductor Technologies
  • 公司介绍
    • 公司
    • 愿景
    • 历史
    • 质量体系
    • 领导团队
    • 环境健康安全体系
    • 慈善与公益
    • 联系我们
    • Distributors
  • 新闻与活动
    • 产品新闻
    • 公司新闻
    • Highlights
    • 贸易展会
    • 实时产品资讯在线申请
    • 视频
    • Webinars
  • 职业
    • 在Vincotech工作
    • Testimonials
    • 空缺职位
    • Contact
  1. 主页
  2. 新闻与活动
  3. 产品新闻
  4. 2016

Archive
  • 2016
  • 2015
  • 2014
  • 公司新闻
  • 产品新闻
  • 2016-11 Product News

    BOOST EFFICIENCY AND SLASH COSTS

    flowNPC 0 & 1 with Infineon TRENCHSTOP™ IGBT5 - Higher performance, lower spend

    更多
  • 2016-10 Product News

    THREE-LEVEL TOPOLOGY FOR SINGLE-PHASE SOLARS

    flowPACK 1 H6.5 - the smart three-level alternative for single-phase solar applications.

    更多
  • 2016-09 Product News

    MiniSKiiP® EXTENDED POWER

    Out now: New MiniSKiiP® PACK 2 & 3

    1200 V/50 - 200 A SIXPACK configuration

    更多
  • 2016-08 Product News

    THE BIDIRECTIONAL FAST-TRACK TO FULL CURRENT CAPABILITY

    fastPACK 0 HC - the new H-bridge to up your application's speed and efficiency.

    更多
  • 2016-08 Product News

    BETTER, FASTER IN - SMALLER, CHEAPER OUT

    Slash your system's costs and shrink its footprint with the new, deeply integrated 600 V IPM - flowIPM 1B CIP.

    更多
  • 2016-06 Product News

    SPEED UP YOUR APPLICATION

    fastPACK 0 SiC - the go-to H-bridge for accelerating SMPS, charger and ESS applications

    更多
  • 2016-06 Product News

    PACKAGED TO MEET YOUR MID-POWER NEEDS

    Out now: VINco E3, the new low-profile package for motion control, solar and UPS applications

    更多
  • 2016-05 Product News

    KEEP ONE STEP AHEAD

    Use the new three-level modules to advance high-voltage devices

    flowNPC 1 split concept up to 30 kW - 2400 V / 150 A

    更多
  • 2016-04 Product News

    MiniSKiiP® MEETS HALF-BRIDGE

    Save up to 15 % on system costs with the NEW MiniSKiiP®DUAL product line,

    更多
  • 2016-01 Product News

    GEARING UP FOR NEXT-GEN UPS

    flowSPFC 0 - 650 V / 10 - 30 kW - the new power factor correction module

    更多
  • 联系我们
  • 申请样品
  • Distributors
Stay in contact
  • X
  • LinkedIn
  • YouTube
  • Xing
  • Sina Weibo
  • BAIDU Pedia
  • WeChat
  • 要闻简报
  • 条款和条件
  • Cookie Declaration
  • 隐私政策
  • 免责声明
  • 版权
  • 网站注册信息
  • 网站地图