Vincotech的压接技术大大降低了PCB组装时间和工作量。 在汽车工业中获得成熟应用的压接引脚使得无需焊接、切割加工时间和成本,提高了生产产能。 无需焊接模块,工程师在设计上享有极大的灵活性。 模块可以轻松地安装在PCB的顶部或底部,无需额外的成本和工作。


  •  减少昂贵的附加焊接
  • 引脚与焊脚位置相同
  • 高载流能力(30 A @ 80°C)
  • 灵活安装到电源模块DCB上
  • 降低生产成本
  • 可靠地冷焊连接到PCB
  • 无PCB孔损坏,可以重复使用
  • 消除热机械推拉力


  • 批准的圆形压接区域
  • 符合DIN和IEC标准
  • 锥形引脚针头
  • 几乎适用于所有封装



Press-fit pin

Press-fit pins forge a solid bond between two parts that requires no additional soldering. Frictional force holds the parts together after they have been joined to create a gas-tight, cold-welded, solder-less connection.

Press-fit pins emerged in the early 1970s. The DIN 41611-5 standard for this technology was first published in 1984, and the IEC guidance 60352-5, "Solder-less connections – Part 5: Press-in connections – General requirements, test methods and practical guidance,” soon followed. Components that meet these qualifications are called 'compliant,' and the term 'compliant pin' is widely used throughout the market.

Engineers started replacing soldered pins and screws with these alternatives in the mid-1980s, and modules equipped with these pins debuted in 2005.

Today these pins come in various sizes and shapes, one of the most common being the eye-of-the-needle, or Press-fit, pin. Its ability to stand up to vibrations prompted automakers to use it for diesel engines.

Figure 1 shows an improved eye-of-the-needle Press fit pin which was patented and has been used in Vincotech modules since 2008.  Follow the links to learn more about European, German and US patents.

Figure 1: Vincotech’s Press-fit pin soldered to a DBC

The pin is made of a copper alloy with nickel plating and a tin finish. Every Vincotech pin comes with an s-bend at the bottom to provide stress relief. It facilitates assembly and may be pushed or pulled as needed for a pre-bent DCB or baseplate. This stress-relief also offsets heat- and cold-induced expansion and contraction.

Hard facts @ 25 °C:


Value Unit



Surface of pin


Recommended PCB finish


Alternative PCB finish

HA(S)L / NiAg

Current carrying capability @ ∆T = 25 K

30* A

Thermal conductivity λ

320 W/mK

Thermal capacity c

381 J/kgK

Thermal expansion coefficient α

17.6 1-06/K

Density ρ

8.92 g/cm³

* Depending on PCB layout

Related Documents

Pressing home the advantage