Vincotech's MiniSKiiP® product family just got bigger. Now, new MiniSKiiP® modules with SIXPACK topology and extended power range are available for industrial and embedded drive applications.
As a true dual-source provider, we offer you a choice of semiconductors, the standard Trench IGBT4 and now the new Mitsubishi Electric gen 7 chip. Either way, these new MiniSKiiP® PACK 2 + MiniSKiiP® PACK 3 modules are the real deal.
MiniSKiiP® EXTENDED POWER
- Superior EMI behavior cuts overall system costs
- 20 % lower static losses than competing products
- Power range extended up to 200 A for flexible, scalable inverter designs
- Available with various pre-applied thermal grease
MiniSKiiP® PACK 2 & 3
Comparison of IGBT M7 chips with competition
With the benefit of Mitsubishi Electric gen 7 chip technology, our new MiniSkiiP® PACK modules leave a smaller chip footprint than competing products. They also provide an extended power range (up to 200 A in MiniSkiiP® PACK 3) in the same-size package to achieve the kind of scaling that slashes costs.
MiniSKiiP® PACK 2 & 3 power range
MiniSKiiP® PACK 2 & 3 - overview:
|Product Family||Part-No.||Voltage in V||Current in A||Comment|
|MiniSKiiP® PACK 2||80-M2126PA050M7-K718F70||1200||50||under development|
|MiniSKiiP® PACK 2||80-M2126PA075M7-K719F70||1200||75||in qualification|
|MiniSKiiP® PACK 2||80-M2126PA100M7-K710F70||1200||100||in qualification|
|MiniSKiiP® PACK 3||80-M3126PA100M7-K828F70||1200||100||in qualification|
|MiniSKiiP® PACK 3||80-M3126PA150M7-K829F70||1200||150||in qualification|
|MiniSKiiP® PACK 3||80-M3126PA200M7-K820F70||1200||200||in qualification|
Samples of the MiniSKiiP® PACK 2 & 3 modules may be sourced on demand from our usual channels.
- PR-16-05_VINco-E3-new-mid-power-package.pdf – PDF, 135 KB