Product News

Vincotech Extends flow E1/E2 Product Line’s Power Range

 

New flowPIM and flowPACK E1/E2 with IGBT M7 out now

 

Vincotech GmbH has extended the power range of its flow E1/E2 product family. Featuring the latest IGBT M7 chip technology, these modules come in PIM (CIB) and sixpack configurations for 25 A, 50 A and 100 A.

flowPACK 1 housing
flow E1

Vincotech, a supplier of module-based solutions for power electronics, already offers the industry's broadest portfolio of standard products. This expansive range just got bigger with the new flow E1/E2 modules for motion control applications. These packages feature a 12 mm-high low inductive housing with two lateral mounting screws, Press-fit pins or solder pins, and no baseplate. The housing’s footprint and pin-out are fully compatible with standard industry packages. Customers can use the same heat sink and a printed circuit board (PCB) with identical specifications.

flow E2

Vincotech engineers optimized the design of flow E1/E2 housings to provide an excellent mechanical contact to the heat sink and achieve superior thermal performance with 15% lower Rth than competing products. These modules also shoehorn higher power density into a smaller package. With multiple sources available for all hardware and electronics, this new product line affords customers greater freedom of choice and helps mitigate supply chain risks. To learn more about Vincotech’s flow E1/E2 products, please visit https://www.vincotech.com/flow-E1+E2/.

Available products
To see currently available products and to select the best module for your application, visit https://www.vincotech.com/product-search/

Vincotech at PCIM Europe 2019
Vincotech will demonstrate the flow E1/E2 product line at PCIM Europe in Nuremberg on May 7 through 9, 2019, at booth no. 310 in hall 9.