DC fast chargers

Wide-bandgap semiconductor technologies such as silicon carbide (SiC) and gallium nitride (GaN) enable the high performance required for next-generation EV charging infrastructure. Their ability to switch at higher frequencies while handling higher voltages allows for greater power density, improved efficiency, and more compact charger architectures.

 Key benefits

• Higher switching frequencies for greater efficiency and smaller systems

• Increased power density for compact, scalable charger designs

• Wide voltage capabilities for EV batteries operating across broad voltage ranges

DC fast charging systems operate at high power levels and place demanding requirements on thermal performance, electrical stability, and long-term reliability. Vincotech addresses these challenges with advanced die-attach and substrate technologies designed for robust operation in high-power charging infrastructure.

Die-attach technology

Advanced die-attach technology strengthens the bond between semiconductor chips and direct copper bonded (DCB) substrates, improving thermal transfer and mechanical stability for reliable high-temperature operation.

• Stronger chip-to-substrate bond for improved thermal performance

• Longer module lifetime

• Stable operation at elevated temperatures

Substrate technology

Power module substrates provide electrical insulation while efficiently dissipating heat from semiconductor devices. By selecting the right substrate material, designers can balance cost, performance, and reliability to suit the application.

• Efficient heat dissipation supporting high-power operation

• Reliable electrical insulation for stable system performance

• Aluminum nitride (AlN) substrates for superior thermal conductivity and compact designs

• Silicon nitride (Si₃N₄) substrates for high mechanical robustness and resistance to thermal cycling

EV charging systems range from compact wall boxes to high-power and megawatt charging stations, each with different mechanical and thermal requirements. Vincotech offers a broad portfolio of power module housings designed to support these diverse applications while ensuring reliable integration and long-term performance.

 Key benefits

• Industry-standard housings and pinouts enabling seamless integration and multi-sourcing strategies

• Baseplate housings for improved robustness and thermal spreading in high-power systems

• Baseplate-less housings enabling compact designs for space-constrained chargers