NEWS | 01 June 2026
The next level of performance
)
flow E3BP+ boosts power density for PV and PCS: built on the proven flow 2 and flow E3BP platforms, Vincotech's new flow E3BP+ baseplate module introduces major system-level gains through module-level innovation. It features Si3N4 substrate for improved mechanical and thermal reliability, along with high-temperature operation up to 175°C.
These advancements significantly increase power density and long-term durability, making the module a perfect fit for next-generation PV and PCS applications.
Main features
Optional Si3N4 substrate
Operates at high junction temperatures up to 175 °C
Capable for transient overloads
Convex 3 mm copper baseplate
Optional pre-applied PC-TIM rated for 150 °C
)