VINcoPress technology
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Lower thermal impedance, uniform pressure and Rth value distribution as well as greater power density: the benefits of VINcoPress are many.
Increasing power capability and density
Superior thermal performance and greater reliability – this is what VINcoPress is all about. Pressing the entire substrate to the heatsink, directly and evenly, it distributes pressure uniformly to mitigate force-induced stress in the substrate and to negate the risk of cracking during assembly. As a result, engineers can design and produce more compact systems at lower cost.
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More choices for the right fit
VINcoPress technology may be paired with aluminum nitride and silicon nitride to optimize designs for thermal conductivity, mechanical robustness and performance requirements. Simply select the right substrate for the given use case.
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