Whether enabling robust operation in standard drives, precision and fast switching in servo applications or smooth, low-noise performance in elevator systems, Vincotech delivers the right solution for each application.
Automated systems demand industrial motor drives that combine high performance with energy efficiency and low operating costs. As a chip-independent power module provider, Vincotech pairs industry-standard packaging with flexible sourcing from leading semiconductor suppliers. The result is a broad portfolio of IGBT, SiC MOSFET, and rectifier-based solutions engineered for efficiency, reliability, and competitive cost.
Vincotech's flow E delivers enhanced thermal performance. Multiple chip sources strengthens supply chain and provides greater flexibility in selecting the optimal chipset.
Fully compatible with industry-standard housings
Same PCB specification for press-fit and solder-pin versions
Complete product line for standard topologies (PIM - CIB, six-pack)
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MiniSKiiP® pairs high performance with flexible chip sourcing, enabling more resilient BOM strategies. This platform supports power switches in the 600 V / 650 V and 1200 V voltage classes, providing efficient and reliable solutions.
Various industry-standard topologies
Solderless spring contact mounting
Pre-applied thermal paste
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Featuring the newly developed SLC (SoLid Cover) package technology, the VINco E3 incorporates a novel insulated metal baseplate that combines an electrically insulating resin layer with a direct-bonded copper layer.
High thermal cycling capability
Reduced thermal resistance
High power density and low stray inductance
)
Vincotech's flow E delivers enhanced thermal performance. Multiple chip sources strengthens supply chain and provides greater flexibility in selecting the optimal chipset.
Fully compatible with industry-standard housings
Same PCB specification for press-fit and solder-pin versions
Complete product line for standard topologies (PIM - CIB, six-pack)
MiniSKiiP® pairs high performance with flexible chip sourcing, enabling more resilient BOM strategies. This platform supports power switches in the 600 V / 650 V and 1200 V voltage classes, providing efficient and reliable solutions.
Various industry-standard topologies
Solderless spring contact mounting
Pre-applied thermal paste
Featuring the newly developed SLC (SoLid Cover) package technology, the VINco E3 incorporates a novel insulated metal baseplate that combines an electrically insulating resin layer with a direct-bonded copper layer.
High thermal cycling capability
Reduced thermal resistance
High power density and low stray inductance
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