MiniSKiiP® PACK 3
80-M3126PB140RA01-K869F81
Topology Housing Voltage Current Main chip technology Product status
Product description
Basic information
- Product line: MiniSKiiP® PACK 3
- Product status: Samples available
- Standard packaging quantity (pieces): 48
Electrical characteristics
- Voltage: 1200 V
- Current: 140 A
- Inverter
- Kelvin Emitter for improved switching performance
- Open Emitter configuration
- Temperature sensor
Sixpack
Chip & isolation characteristics
- Easy paralleling
- Low collector emitter saturation voltage
- Low turn-off losses
IGBT RGA
- Base isolation: Al2O3
Isolation
Mechanical & housing characteristics
- Footprint: 82 mm x 59 mm
- Height: 16 mm
- Pin type: Spring contact
MiniSKiiP® 3
Available options
| Thermal grease options | Thermal conductivity | Max. operation temperature | Lid options | Order code |
|---|---|---|---|---|
| Without thermal grease | - | - | Standard (6.5 mm) Thin (2.8 mm) | -/0A/ -/0B/ |
| Silicone-based standard grease - Wacker P12 | 0.81 W/(m·K) | 200 °C | Standard (6.5 mm) Thin (2.8 mm) | -/1A/ -/1B/ |
| Silicone-free standard grease – Thermigrease® TG20032 | 2.5 W/(m·K) | 208 °C | Standard (6.5 mm) Thin (2.8 mm) | -/4A/ -/4B/ |
| High performance thermal paste - HPTP (silicon-based) | 2.5 W/(m·K) | 180 °C | Standard (6.5 mm) Thin (2.8 mm) | -/5A/ -/5B/ |
Exemplary order number: 80-M3126PB140RA01-K869F81-/5B/
Thermal documents
Thermigrease® TG20032 TIM thickness
- Minimum: 50 um
- Maximum: 85 um
- Stencil thickness: 70 um
TIM pattern
Download (PDF) Download (DXF)HPTP TIM thickness
- Minimum: 70 um
- Maximum: 130 um
- Stencil thickness: 110 um
TIM pattern
Download (PDF) Download (DXF)Wacker P12 TIM thickness
- Minimum: 50 um
- Maximum: 90 um
- Stencil thickness: 80 um