fastPACK 0 SiC
10-PC124PA026ME-L629F91Y


Product description
Basic information
- Product line: fastPACK 0 SiC
- Product status: Series
- Standard packaging quantity (pieces): 0
Electrical characteristics
- Voltage: 1200 V
- Current: 55 A
- R(DS)on: 26 mOhm
- Dual halfbridge
- Integrated DC capacitor
- Kelvin Emitter for improved switching performance
- Open Emitter configuration
- Temperature sensor
H-Bridge
Chip & isolation characteristics
- Fast intrinsic diode with low reverse recovery
- High blocking voltage with low on-resistance
- High speed switching with low capacitance
SiC MOSFET
- Base isolation: Al2O3
Isolation
Mechanical & housing characteristics
- Mechanical connection to PCB: 4 towers
- Footprint: 66 mm x 32.5 mm
- Height: 12 mm
- Pin type: Press-fit pin
flow 0
Thermal documents
PSX-P7 TIM thickness
- Minimum: 30 um
- Maximum: 80 um
- Stencil thickness: 70 um
PTM6000HV TIM thickness
- Minimum: 30 um
- Maximum: 80 um
- Stencil thickness: 70 um