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fastPACK 1

10-FY074PA100SM01-L583F18

Topology Housing Voltage Current Main chip technology Product status
H-Bridge flow 1 650 V 100 A IGBT H5 Series-Ops
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Product description

Basic information

  • Product line: fastPACK 1
  • Product status: Series-Ops
  • Standard packaging quantity (pieces): 100

Electrical characteristics

  • Voltage: 650 V
  • Current: 100 A

    H-Bridge

  • Integrated DC capacitor
  • Kelvin Emitter for improved switching performance
  • Open Emitter configuration
  • Temperature sensor

Chip & isolation characteristics

    IGBT H5

  • High efficiency in hard switching and resonant topologies
  • High speed switching
  • Low gate charge

    Isolation

  • Base isolation: Al2O3

Mechanical & housing characteristics

    flow 1

  • Mechanical connection to PCB: 4 towers
  • Footprint: 82 mm x 37.4 mm
  • Height: 12 mm
  • Pin type: Solder pin

Thermal documents

Handling instruction phase-change material
Download (PDF)
Protection of TIM – ProCap
Download (PDF)

Mechanical documents

Handling instruction
Download (PDF)
Housing dimensions
Download (PDF)
3D module outline
Download (STP)

Other documents

RoHS statement
Download (PDF)
REACH statement
Download (PDF)
UL certificate
Download (PDF)
Technical Explanation of Datasheet
Download (PDF)
Product Qualification at Vincotech
Download (PDF)
10-FY074PA100SM01-L583F1810-FY074PA100SM01-L583F18
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