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Product description

Basic information

  • Product line: flowPACK E1 SiC
  • Product status: Series-Ops
  • Standard packaging quantity (pieces): 100

Electrical characteristics

  • Voltage: 1200 V
  • Current: 20 A
  • R(DS)on: 75 mOhm

    Sixpack

  • 3ph Inverter
  • Low and high side Kelvin Emitter for improved switching performance
  • MOSFET
  • Open Emitter configuration
  • Temperature sensor

Chip & isolation characteristics

    SiC MOSFET

  • High Blocking Voltage with low drain source on state resistance
  • High speed SiC-MOSFET technology
  • Resistant to Latch-up

    Isolation

  • Base isolation: Al2O3

Mechanical & housing characteristics

    flow E1

  • Mechanical connection to PCB: 4 towers
  • Footprint: 62.8 mm x 34.8 mm
  • Height: 12 mm
  • Pin type: Press-fit pin

Thermal documents

Handling instruction phase-change material
Download (PDF)

Mechanical documents

Handling instruction
Download (PDF)
Housing dimensions
Download (PDF)
3D module outline
Download (STP)
Vincotech press-fit pins
Download (PDF)
Press-in tool: U-shape with TIM
Download (STP)
Press-in tool: Flat without TIM
Download (STP)
Press-in tool: Bottom
Download (STP)
Press-out tool
Download (STP)

Other documents

RoHS statement
Download (PDF)
REACH statement
Download (PDF)
UL certificate
Download (PDF)
Technical Explanation of Datasheet
Download (PDF)
Product Qualification at Vincotech
Download (PDF)
10-EZ126PB075ME-LS17F08T10-EZ126PB075ME-LS17F08T
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