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Product description

Basic information

  • Product line: flowPACK E2 SiC
  • Product status: Samples available
  • Standard packaging quantity (pieces): 100

Electrical characteristics

  • Voltage: 1200 V
  • Current: 70 A
  • R(DS)on: 18 mOhm

    PIM (CIB)

  • 3ph Inverter
  • Low and high side Kelvin Emitter for improved switching performance
  • MOSFET
  • Open Emitter configuration
  • Temperature sensor

Chip & isolation characteristics

    SiC MOSFET

  • Easy paralleling
  • Low on-resistance
  • Fast switching speed
  • Fast recovery body diode

    Isolation

  • Base isolation: Al2O3

Mechanical & housing characteristics

    flow E2

  • Mechanical connection to PCB: 4 towers
  • Footprint: 62.8 mm x 57.7 mm
  • Height: 12 mm
  • Pin type: Press-fit pin

Thermal documents

PSX-P7 TIM thickness
  • Minimum: 45 um
  • Maximum: 75 um
  • Stencil thickness: 70 um
TIM pattern
Download (PDF) Download (DXF)
PTM6000HV TIM thickness
  • Minimum: 45 um
  • Maximum: 75 um
  • Stencil thickness: 70 um
TIM pattern
Download (PDF) Download (DXF)
Handling instruction phase-change material
Download (PDF)

Mechanical documents

Handling instruction
Download (PDF)
Housing dimensions
Download (PDF)
3D module outline
Download (STP)
Vincotech press-fit pins
Download (PDF)
Press-out tool
Download (STP)
Press-in tool: Bottom
Download (STP)
Press-in tool: Flat with TIM
Download (STP)
Press-in tool: U-shape with TIM
Download (STP)

Other documents

RoHS statement
Download (PDF)
REACH statement
Download (PDF)
UL certificate
Download (PDF)
Technical Explanation of Datasheet
Download (PDF)
Product Qualification at Vincotech
Download (PDF)
10-EY126PB018MR-MA99F08T10-EY126PB018MR-MA99F08T
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