flowPACK E2 SiC
10-EY126PB018MR-MA99F08T


Product description
Basic information
- Product line: flowPACK E2 SiC
- Product status: Samples available
- Standard packaging quantity (pieces): 100
Electrical characteristics
- Voltage: 1200 V
- Current: 70 A
- R(DS)on: 18 mOhm
- 3ph Inverter
- Low and high side Kelvin Emitter for improved switching performance
- MOSFET
- Open Emitter configuration
- Temperature sensor
PIM (CIB)
Chip & isolation characteristics
- Easy paralleling
- Low on-resistance
- Fast switching speed
- Fast recovery body diode
SiC MOSFET
- Base isolation: Al2O3
Isolation
Mechanical & housing characteristics
- Mechanical connection to PCB: 4 towers
- Footprint: 62.8 mm x 57.7 mm
- Height: 12 mm
- Pin type: Press-fit pin
flow E2
Thermal documents
PSX-P7 TIM thickness
- Minimum: 45 um
- Maximum: 75 um
- Stencil thickness: 70 um
TIM pattern
Download (PDF) Download (DXF)PTM6000HV TIM thickness
- Minimum: 45 um
- Maximum: 75 um
- Stencil thickness: 70 um