Skip to Content Product description
Basic information
- Product line: fastPACK E2 SiC
- Product status: Series
- Standard packaging quantity (pieces): 100
Electrical characteristics
- Voltage: 1200 V
- Current: 165 A
- R(DS)on: 8.67 mOhm
H-Bridge
- Kelvin Emitter for improved switching performance
- Open Emitter configuration
- Temperature sensor
Chip & isolation characteristics
SiC MOSFET
- Fast intrinsic diode with low reverse recovery
- High blocking voltage with low on-resistance
- High speed switching with low capacitance
Isolation
- Base isolation: Al2O3
Mechanical & housing characteristics
flow E2
- Mechanical connection to PCB: 4 towers
- Footprint: 62.8 mm x 57.7 mm
- Height: 12 mm
- Pin type: Press-fit pin
Thermal documents
Handling instruction phase-change material
Download (PDF) Mechanical documents
Handling instruction
Download (PDF) Housing dimensions
Download (PDF) 3D module outline
Download (STP) Vincotech press-fit pins
Download (PDF) Press-out tool
Download (STP) Press-in tool: Bottom
Download (STP) Press-in tool: Flat with TIM
Download (STP) Press-in tool: U-shape with TIM
Download (STP) Other documents
RoHS statement
Download (PDF) REACH statement
Download (PDF) UL certificate
Download (PDF) Technical Explanation of Datasheet
Download (PDF) Product Qualification at Vincotech
Download (PDF)