MiniSKiiP® DUAL 3
80-M3122PA300M7-K839F70
Topology Housing Voltage Current Main chip technology Product status
Product description
Basic information
- Product line: MiniSKiiP® DUAL 3
- Product status: Series
- Standard packaging quantity (pieces): 48
Electrical characteristics
- Voltage: 1200 V
- Current: 300 A
- Half Bridge
- Temperature sensor
Half-Bridge
Chip & isolation characteristics
- Easy paralleling
- Low turn-off losses
- Low collector emitter saturation voltage
- Positive temperature coefficient
- Short tail current
- Switching optimized for EMC
IGBT M7
- Base isolation: Al2O3
Isolation
Mechanical & housing characteristics
- Footprint: 82 mm x 59 mm
- Height: 16 mm
- Pin type: Spring contact
MiniSKiiP® DUAL 3
Thermal documents
Wacker P12
TIM thickness
- Minimum: 50 um
- Maximum: 90 um
- Stencil thickness: 80 um
HPTP
TIM thickness
- Minimum: 70 um
- Maximum: 130 um
- Stencil thickness: 110 um
Thermigrease® TG20032
TIM thickness
- Minimum: 50 um
- Maximum: 85 um
- Stencil thickness: 80 um