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MiniSKiiP® DUAL 2

80-M2122PA200SC-K709F40

Topology Housing Voltage Current Main chip technology Product status
Half-Bridge MiniSKiiP® DUAL 2 1200 V 200 A IGBT4 Series
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Product description

Basic information

  • Product line: MiniSKiiP® DUAL 2
  • Product status: Series
  • Standard packaging quantity (pieces): 72

Electrical characteristics

  • Voltage: 1200 V
  • Current: 200 A

    Half-Bridge

  • Half Bridge
  • Temperature sensor

Chip & isolation characteristics

    IGBT4

  • Easy paralleling
  • Low turn-off losses
  • Low collector emitter saturation voltage
  • Positive temperature coefficient
  • Short tail current

    Isolation

  • Base isolation: Al2O3

Mechanical & housing characteristics

    MiniSKiiP® DUAL 2

  • Footprint: 58.9 mm x 51.9 mm
  • Height: 16 mm
  • Pin type: Spring contact

Thermal documents

Wacker P12
TIM thickness
  • Minimum: 65 um
  • Maximum: 95 um
  • Stencil thickness: 90 um
Download (PDF) Download (DXF)
HPTP
TIM thickness
  • Minimum: 70 um
  • Maximum: 130 um
  • Stencil thickness: 110 um
Download (PDF) Download (DXF)
Thermigrease® TG20032
TIM thickness
  • Minimum: 65 um
  • Maximum: 95 um
  • Stencil thickness: 90 um
Download (PDF) Download (DXF)

Mechanical documents

Handling instruction
Download (PDF)
Housing dimensions
Download (PDF)
3D module outline
Download (STP)

Other documents

RoHS statement
Download (PDF)
REACH statement
Download (PDF)
UL certificate
Download (PDF)
Technical Explanation of Datasheet
Download (PDF)
Product Qualification at Vincotech
Download (PDF)
80-M2122PA200SC-K709F4080-M2122PA200SC-K709F40
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