封装尺寸: 

  • 高: 17 mm
  • 长: 152 mm
  • 宽: 62 mm
  • 新型工业标准,低剖面封装
  • 三菱第七代IGBT技术
  • 提升的热阻特性
  • 高的热和功率循环能力
  • 内置 NTC
  • 可扩展的产品平台 (半桥, sixpack, PIM) 
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Housing features 

  • Industry standard low-profile package
  • Improved thermal impedance
  • High thermal and power cycling capability

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The new IMB (Insulated Metal Baseplate) combines an electrically insulating resin layer with a direct-bonded top- and bottom-side copper layer. Direct potting resin distributes the mechanical stress more uniformly than silicone gel.

Comparison SLC with conventional technology
Comparison SLC with conventional technology
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Plate Contacts Mounting Holes Pins

Outline drawing 

VINco E3
VINco E3