VINCOTECH’S NEW MID-POWER VINcoPACK E3 OUT NOW
/ Extended module lifetime based on the new SLC- and IMB Technology
/ Increased power density featuring the new IGBT M7 chip technology
/ Multiple chip sourcing ensuring the highest supply chain safety
/ Cost competitive w/o expensive base plate component
/ Industry-standard, low-profile package
/ Built-in NTC
/ Scalable product platform
- Industrial drives
Low-profile package for mid-power applications
VINcoPACK E3 overview:
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Alternatively please view some more information on the complete VINco E3 range here.
Samples of this new sixpack module may be sourced on demand from our usual channels.