10-EY12PMA035SC-L188A48T

flowPIM® E2

Topology:	PIM (CIB)

Chip technology (main switch):	IGBT4

Base isolation (e.g. ceramic):	Al₂O₃
Electrical interconnection:	Press-fit
Module simulation data available in VincotechISE:

Module housing:	flow E2
Mechanical connection to the PCB:	4 towers
Footprint:	62.8 mm x 57.7 mm
Height:	12 mm

Handling instruction PDF, 1 MB
The handling instruction gives information during the design phase of the application and for usage in the production.
To ensure a proper long term stability and reliability of the power module in the application details about the PCB requirements, heat sinks and thermal interface material as well as instructions on the assembly process are shown.
Packaging datasheet PDF, 104 kB
The package data gives information about dimensions of the housing.
3D module outline (STEP) STP, 7 MB
The 3D step file can be downloaded for the implementation into your CAD system.
UL (Underwriters laboratories) PDF, 309 kB
Vincotech power modules are recognized by UL (Underwriters Laboratories). The UL Mark indicates that UL has tested representative samples of the product and found it to be compliant with the applicable standard or other requirements with respect to its potential risk of fire, electric shock and mechanical hazards.
RoHS PDF, 232 kB
All Vincotech standard power modules comply with the RoHS specification.