Download the pattern to apply on Vincotech modules
Applying thermal interface material is unavoidable to guarantee a good thermal coupling between the power module and the heatsink. The material provides an extremely long stability, which is the most important characteristic. Especially modules with convex pre-bent lower-surfaces support this requirement.
To assure the best thermal resistance a specific amount of thermal interface material is essential. Therefore, Vincotech offers for each power module a recommended TIM pattern, which can be downloaded below.
Pattern for Vincotech modules
Use the below table and download the thermal interface material pattern of choice.
Patterns and thicknesses can be used for phase-change materials and for greases as well.
|
Module |
Minimum / µm | Typical / µm | Maximum / µm | dxf file |
|---|---|---|---|---|
|
flow S3 |
50 | 65 | 80 | flow S3 pattern |
|
flow 0B |
40 | 55 | 70 | flow 0B pattern |
|
flow 0 |
30 | 55 | 80 | flow 0 pattern |
|
flow 1B |
70 | 90 | 110 | flow 1B pattern |
|
flow 1C |
70 | 90 | 110 | flow 1C pattern |
|
flow 1 Al2O3 |
30 | 50 | 80 | flow 1 pattern |
|
flow 1 AlN |
30 | 50 | 60 | flow 1 pattern |
|
flow 2 |
80 | 110 | 140 | flow 2 pattern |
|
flow90 0 |
35 | 60 | 85 | flow90 0 pattern |
|
flow90 1 |
45 | 70 | 95 | flow90 1 pattern |
|
flow E1 |
45 | 55 | 65 | flow E1 pattern |
|
flow E2 |
45 | 55 | 65 | flow E2 pattern |
|
VINco X |
115 | 140 | 160 | VINcoX pattern |
|
MiniSKiiP® 0 |
40 | 55 | 70 | MiniSKiiP® 0 pattern |
|
MiniSKiiP® 1 |
50 | 70 | 90 | MiniSKiiP® 1 pattern |
|
MiniSKiiP® 2 |
60 | 75 | 90 | MiniSKiiP® 2 pattern |
|
MiniSKiiP® 3 |
50 | 65 | 80 | MiniSKiiP® 3 pattern |
|
VINco E3 |
100 | 120 | 140 | VINco E3 pattern |
|
Document Name |
Type | Date | Download |
|---|---|---|---|
|
Power Modules with Phase-Change Material |
Application Note | 2020-11 | |
|
Thermal interface material |
Video | ||
|
Application of thermal grease |
Video |