VINco X8
242.5 mm x 129.2 mm
Possible features
- Optimized for three-level topologies
- Enables high switching frequencies
- Low inductive package
- Easy paralleling
- Optimal current sharing
- Thermo-mechanical push-and-pull force relief
- M6 High Power Screw Contact
- M4 Low Inductive Interface
- Press-fit connection to driver PCB
- Topology
- Sub-Topology
-
Product line
-
Voltage
in V -
Current
in A -
Main Chip technology
-
Height
in mm
| Part-no details / Part-no datasheet | Product status | Topology | Sub-Topology | Product line | Voltage in V |
Current in A |
Main Chip technology | Housing family | Height in mm |
Isolation | Simulation |
|---|