Unlike most other power modules based on a DCB or a DCB + copper baseplate, the flow 1C housing features a thick-film substrate made of aluminum oxide.

This substrate is well-suited for achieving fine pitch structures. And with that, flow 1C provides the perfect home for discrete components such as capacitors, diodes and even gate-driver ICs.

The enhanced size in comparison with flow 1B allows achieving a higher level of integration and make it suitable for a wide range of applications.

This is why our thick-film based offering consists exclusively of intelligent power modules (IPMs). All are available with Press-fit pins for easy, reliable assembly and with a pre-applied layer of phase-change material for enhanced thermal resistance to the heatsink.