Empowering your ideas

We are seeking a Product Marketing Manager.

Team up with us!

Articles / Application Notes

MiniSKiiP® with a Si3N4 AMB Substrate >>

Embedded Designs Drive Tomorrow’s Solutions >>

>> more articles

Thermal Measurement with an Integrated NTC Thermistor >>

>> more application notes


MiniSKiiP®PACK 2 & 3: the new sixpack topology with extended power range

fastPACK 0 HC: the bidirectional fast-track to full current capability.

VINco E3: Vincotech’s new low-profile package for motion control, solar and UPS applications.

MiniSKiip®DUAL modules: MiniSKiip® meets Half-Bridge.

flowPACK 1 H6.5: Vincotech’s new three-level topology for solar applications