High-end power modules must meet challenging requirements for thermal and electrical performance and reliability. Vincotech has taken sintering to the next level to meet these demands and is able replace all soldered points with sintered connections.
Sintering – the Multiple Solution
- All Vincotech suppliers' chips may be sintered
- Chip substrate and baseplate sintered in one step
- Multi-component capability – chip, NTC and shunt may be sintered together
- Multi-level capability – up to 3 mm difference in height can be accommodated
- Lower thermal expansion rates for improved load cycling capability