Basic module information
|Product line:||flow7PACK 1|
|Product status:||Series production|
|Break down voltage:||1200 V|
|Nominal chip current rating:||25 A|
|Standard Packing Quantity:||100|
|Module datasheet:||PDF, 3 MB|
|Simulation of target application:||PDF, 985 kB|
- Open Emitter configuration
- Temperature sensor
|Chip technology (main switch):||IGBT4|
- Easy paralleling
- Low turn-off losses
- Low collector emitter saturation voltage
- Positive temperature coefficient
- Short tail current
|Base isolation (e.g. ceramic):||Al2O3|
|Electrical interconnection:||Solder pin|
|Module simulation data available in VincotechISE:|
Housing related details
|Module housing:||flow 1|
|Mechanical connection to the PCB:||4 towers|
|Footprint:||82 mm x 37.4 mm|
- Convex shaped substrate for superior thermal contact
- Thermo-mechanical push-and-pull force relief
Protection of thermal interface material - Procap
ProCaps protect thermal interface material against contamination.
PDF, 3 MB
The handling instruction gives information during the design phase of the application and for usage in the production.
To ensure a proper long term stability and reliability of the power module in the application details about the PCB requirements, heat sinks and thermal interface material as well as instructions on the assembly process are shown.
PDF, 80 kB
The package data gives information about dimensions of the housing.
3D module outline (STEP)
STP, 2 MB
The 3D step file can be downloaded for the implementation into your CAD system.
Product Qualification at Vincotech
PDF, 293 kB
Vincotech’s qualification tests follow the minimum requirements for the series release of power modules described in this document. These tests also apply for release and re-qualification of modified products.
UL (Underwriters laboratories)
Vincotech power modules are recognized by UL (Underwriters Laboratories). The UL Mark indicates that UL has tested representative samples of the product and found it to be compliant with the applicable standard or other requirements with respect to its potential risk of fire, electric shock and mechanical hazards.
PDF, 323 kB
All Vincotech standard power modules comply with the RoHS specification.
||Topology:10-H-BRIDGE||Sub-Topology:ST-001-H-BRIDGE-03||Product line:fastPACK 0 H||Voltage:600||Current:50||Main Chip technology:IGBT3||Housing family:flow 0||Height:17mm||Module datasheet: PDF|
||Topology:03-SIXPACK+RECTIFIER||Sub-Topology:ST-038-SIXPACK-02||Product line:flowPACK 1 + R||Voltage:1200||Current:15||Main Chip technology:IGBT4||Housing family:flow 1||Height:12mm||Module datasheet: PDF|
||Topology:05-PIM(CIB)||Sub-Topology:ST-075-PIM(CIB)-24||Product line:flow90PIM 1||Voltage:600||Current:20||Main Chip technology:IGBT3||Housing family:flow 90 1||Module datasheet: PDF|