flow7PACK 1

Basic module information

Part number: 10-F1127PA025SC-L167E09
Product line: flow7PACK 1
Product status: Series production
Break down voltage: 1200 V
Nominal chip current rating: 25 A
Standard Packing Quantity: 100
Module datasheet: PDF, 3 MB
Simulation of target application: PDF, 985 kB


Product details

Topology: Sevenpack
  • Open Emitter configuration
  • Temperature sensor
  • Brake+Inverter
Chip technology (main switch): IGBT4
  • Easy paralleling
  • Low turn-off losses
  • Low collector emitter saturation voltage
  • Positive temperature coefficient
  • Short tail current
Base isolation (e.g. ceramic): Al2O3
Electrical interconnection: Solder pin
Module simulation data available in VincotechISE:


Housing related details

Module housing: flow 1
Mechanical connection to the PCB: 4 towers
Footprint: 82 mm x 37.4 mm
Height: 17 mm
  • Convex shaped substrate for superior thermal contact
  • Thermo-mechanical push-and-pull force relief

Related documents

  • Handling instruction  PDF, 3 MB

    The handling instruction gives information during the design phase of the application and for usage in the production.
    To ensure a proper long term stability and reliability of the power module in the application details about the PCB requirements, heat sinks and thermal interface material as well as instructions on the assembly process are shown.

  • Packaging datasheet  PDF, 80 kB

    The package data gives information about dimensions of the housing.

  • 3D module outline (STEP)  STP, 2 MB

    The 3D step file can be downloaded for the implementation into your CAD system.

  • UL (Underwriters laboratories)  PDF, 309 kB

    Vincotech power modules are recognized by UL (Underwriters Laboratories). The UL Mark indicates that UL has tested representative samples of the product and found it to be compliant with the applicable standard or other requirements with respect to its potential risk of fire, electric shock and mechanical hazards.

  • RoHS  PDF, 0

    All Vincotech standard power modules comply with the RoHS specification.

Complimentary Products

10-F1127PA025SC-L167E09 Topology:10-H-BRIDGE Sub-Topology:ST-001-H-BRIDGE-03 Product line:fastPACK 0 H Voltage:600 Current:50 Main Chip technology:IGBT3 Housing family:flow 0 Height:17mm Module datasheet: PDF
10-F1127PA025SC-L167E09 Topology:03-SIXPACK+RECTIFIER Sub-Topology:ST-038-SIXPACK-02 Product line:flowPACK 1 + R Voltage:1200 Current:15 Main Chip technology:IGBT4 Housing family:flow 1 Height:12mm Module datasheet: PDF
10-F1127PA025SC-L167E09 Topology:05-PIM(CIB) Sub-Topology:ST-075-PIM(CIB)-24 Product line:flow90PIM 1 Voltage:600 Current:20 Main Chip technology:IGBT3 Housing family:flow 90 1 Module datasheet: PDF
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