fastPACK 0 SiC
10-PC124PA030MS-L629F76Y


Product description
Basic information
- Product line: fastPACK 0 SiC
- Product status: Samples available
- Standard packaging quantity (pieces): 135
Electrical characteristics
- Voltage: 1200 V
- Current: 48 A
- R(DS)on: 30 mOhm
- Dual halfbridge
- Integrated DC capacitor
- Kelvin Emitter for improved switching performance
- Open Emitter configuration
- Temperature sensor
H-Bridge
Chip & isolation characteristics
- High Blocking Voltage with low drain source on state resistance
- High speed SiC-MOSFET technology
- Resistant to Latch-up
SiC MOSFET
- Base isolation: Al2O3
Isolation
Mechanical & housing characteristics
- Mechanical connection to PCB: 4 towers
- Footprint: 66 mm x 32.5 mm
- Height: 12 mm
- Pin type: Press-fit pin
flow 0
Thermal documents
PSX-P7
TIM thickness
- Minimum: 30 um
- Maximum: 80 um
- Stencil thickness: 70 um
PTM6000HV
TIM thickness
- Minimum: 30 um
- Maximum: 80 um
- Stencil thickness: 70 um