Download the pattern to apply on Vincotech modules 

The application of thermal interface material is unavoidable to guarantee a good thermal coupling between the power module and the heatsink. The stability over time is the most important characteristic of this material. Especially pre-bended convex module undersides support this requirement.

For a good thermal resistance the right amount of thermal interface material is essential. Therefore a recommended TIM pattern for every power module which Vincotech offers can be downloaded.

Pattern for Vincotech modules 

Use the below table and download the thermal interface material pattern of choice.

dxf files of recommended TIM pattern
Module Minimum / µm Typical / µm Maximum / µm dxf file
flow 0B 40 55 70 flow0B_pattern.dxf
flow 0 30 55 80 flow0_pattern.dxf
flow 1B 70 99 110 flow1B_pattern.dxf
flow 1C 70 90 110 flow1C_pattern.dxf
flow 1 Al2O3 30 50 80 flow1_pattern.dxf
flow 1 AlN 30 50 60 flow1_pattern.dxf
flow 2 80 110 140 flow2_pattern.dxf
flow90 0 35 60 85 flow90-0_pattern.dxf
flow90 1 45 70 95 flow90-1_pattern.dxf
flow E1 45 55 65 flowE1_pattern.dxf
flow E2 45 55 65 flowE2_pattern.dxf
VINco X 115 140 160 VINcoX_pattern.dxf
MiniSKiiP 0 40 55 70 MiniSKiiP0.dxf
MiniSKiiP 1 50 70 90 MiniSKiiP1.dxf
MiniSKiiP 2 60 75 90 MiniSKiiP2.dxf
MiniSKiiP 3 80 95 110 MiniSKiiP3.dxf
VINco E3 100 120 140 VINco E3.dxf
Related Information
Document Name Type Date Download
Thermal interface material Application Note 2013-10 PDF
Power Modules with Phase-Change Material Application Note 2012-07 PDF
Thermal interface material Video
Application of thermal grease Video