相变材料 

使用相变材料Loctite® PowerstrateXtremeTM (PSX) 来实现模块和散热器之间的热导系数可实现多方面的优势。相变材料在室温下呈固态,在运输和模块组装期间可有效防污。我们的内部丝网印刷工艺可确保均匀的材料厚度,实现最高的热传递能力。相位材料已发布用于所有flow封装,包括采用或未采用与Al2O3 DCB结合的底板,以及采用Si3N4 DCB的MiniSKiiP®

 

特性

  • 固体、不粘表面;最大限度地减少污染风险,防止层损坏
  • 快速、轻松组装模块
  • 生产工艺更简单;无需丝印设备
  • 自动丝网印刷具有极高的精度和可靠性
  • 低热阻,优化厚度

     

优点: 

  • 在基于Al2O3的模块中,从Tj到散热器的Rth(J-s)降幅高达20%
  • 对于基于AlN的高性能模块,从Tj到散热器的Rth(J-s)降幅高达30%
  • 输出功率更高、使用寿命更长
  • 支持标准焊接型材(例如J-STD-001、J-STD-003)
  • 兼容压接引脚

 

 

 

Parameter Value Unit
Specific gravity 2 g/cm²
Thermal conductivity 3.4 W/m*K
Phase change temperature +45 °C
Viscosity above phase-change temperature Thixotropic

Protection of thermal interface material 

ProCap assemply

ProCap 0 and ProCap 1

During transport of modules mainly semi-assembled module the thermal paste, could be smudged, scratched or even contaminated by swirled particles /dust. In a wave soldering oven the paste could be contaminated with particles or smeared by the curtain at the oven exit. To protect the thermal interface material from all this, these ProCaps (protection caps) have been developed during and after PCB assembly.


The ProCaps (short for Protecting Cap) are available for flow 0 and flow 1 type power modules with thermal interface materials (TIM). It can be used for both, thermal grease and phase-change material.

 

ProCap Ordering codes:

ProCap for flow 0 modules - FLOW0-PROCAP-1-L
ProCap for flow 1 modules - FLOW1-PROCAP-1-L

 

ProCap Handling Instruction:

ProCap - Datasheet + Handling instruction