flowPACK E1

Basic module information

Part number: 10-EZ066PA030SA-L854F38T
Product line: flowPACK E1
Product status: Series production
Break down voltage: 600 V
Nominal chip current rating: 30 A
Standard Packing Quantity: 135
Additional information
  • Equivalent: IFX FS30R06W1E3_B11

Product details

Topology: Sixpack
  • Open Emitter configuration
  • Temperature sensor
  • Inverter
  • Low side Kelvin Emitter for improved switching performance
Chip technology (main switch): IGBT3
  • Easy paralleling
  • Low turn-off losses
  • Low collector emitter saturation voltage
  • Positive temperature coefficient
  • Short tail current
Electrical interconnection: Press-fit pin


Housing related details

Module housing: flow E1
Mechanical connection to the PCB: 4 towers
Footprint: 62.8 mm x 34.8 mm
Height: 12 mm
  • Convex shaped substrate for superior thermal contact
  • Compact design
  • CTI600 Housing material
  • Thermo-mechanical push-and-pull force relief
  • Reliable cold welding connection to PCB
  • No PCB hole damage to enable reuse

Related documents

  • Product Qualification at Vincotech PDF, 293 kB

    Vincotech’s qualification tests follow the minimum requirements for the series release of power modules described in this document. These tests also apply for release and re-qualification of modified products.

  • UL (Underwriters laboratories)  PDF, 309 kB

    Vincotech power modules are recognized by UL (Underwriters Laboratories). The UL Mark indicates that UL has tested representative samples of the product and found it to be compliant with the applicable standard or other requirements with respect to its potential risk of fire, electric shock and mechanical hazards.

  • RoHS  PDF, 392 kB

    All Vincotech standard power modules comply with the RoHS specification.

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