Pre-Applied Thermal Interface Material (TIM)

Vincotech also offers pre-applied thermal conducting material. The benefits of using phase change material for thermal conducting between the power module and heat sink are considerable. This material is solid at room temperature. This makes it smear-resistant during transportation and when assembling the power module. The screen-printing process is very accurate, so the material’s thickness is well defined and can be optimized for maximum heat transfer capability.

Features:

• Faster and easier assembly of the power module
• Thermal interface material (TIM) with optimized thickness
• Better R_th and reduced risk of DCB cracking
• Easier production process; no need for screen printing facilities
• Automated screen printing for utmost precision and reliability
• No risk of smearing the thermal paste; material is solid at room temperature
• Standard solder profile applicable (e.g. J-STD-001, J-STD-003)

Properties: