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Articles / Application Notes

MiniSKiiP® with a Si3N4 AMB Substrate >>

Embedded Designs Drive Tomorrow’s Solutions >>

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Thermal Measurement with an Integrated NTC Thermistor >>

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Vincotech's new fastPACK 0 MOS and fastPACK 1 MOS: reliable, robust and remarkably efficient

flowIPM 1C CIB 1200 V: for the deepest level of integration

MiniSKiiP®PACK 2 & 3: the new sixpack topology with extended power range

fastPACK 0 HC: the bidirectional fast-track to full current capability.

VINco E3: Vincotech’s new low-profile package for motion control, solar and UPS applications.

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