Articles / Application Notes
MiniSKiiP® with a Si3N4 AMB Substrate >>
flowIPM 1C CIB 1200 V: for the deepest level of integration
MiniSKiiP®PACK 2 & 3: the new sixpack topology with extended power range
fastPACK 0 HC: the bidirectional fast-track to full current capability.
VINco E3: Vincotech’s new low-profile package for motion control, solar and UPS applications.
MiniSKiip®DUAL modules: MiniSKiip® meets Half-Bridge.