New MiniSKiiP^® PIM Modules with latest IGBT4

Vincotech’s expands its second source compatible MiniSKiiP^® PIM module range with IGBT4 versions ranging from 8 A to 100 A 1200 V in 3 different housings.
 
The new MiniSKiiP^® PIM modules utilize the latest IGBT4 chip technology from Infineon for improved EMC behaviour. These new modules are offered in three different sizes targeting motor drive applications up to 30kW.

Possible sizes:

• MiniSKiiP^® 1 PIM - size 1 (42 x 40 mm²)
  covering 8 A 1200 V to 15 A 1200 V
   
• MiniSKiiP^® 2 PIM - size 2 (59 x 52 mm²)
  covering 25 A 1200 V to 35 A 1200 V
   
• MiniSKiiP^® 3 PIM - size 3 (82 x 59 mm²)
  covering 50 A 1200 V to 100 A 1200 V
   

General Features:

• PIM (rectifier, brake chopper, inverter) topology
• latest IGBT4 chip technology
• solder less interconnection
• designed for motor drives up to 30 kW 
• pin-compatible with previous versions
• fully compatible with Semikron pedants
• Temperature Sensor
• 17mm housing
• optional with pre-applied thermal grease

All modules provide 3-phase input rectifier, 3-phase output inverter, brake chopper and additional thermistor for temperature measurement (PIM topology). Vincotech is offering all of their MiniSKiiP^® on request also with pre-applied thermal grease for easy use. They are pin-compatible with the previous version of modules providing easy upgrade possibility.

The modules are fully compatible with the pendant from Semikron. The cross reference can be found below or on the Vincotech homepage where also the data sheets could be downloaded. The modules are in serial production, samples can be ordered via the standard sales channels.