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Industrial

Design, layout and testing options

  • Design and layout service
  • Mechanical design
  • Standard as well as specific measurement technology
Industrial

Assembly technologies

  • Standard SMT, as well as BGA, µBGA and CSP, also with a lead-free technology
  • Leadframe assembly SMT or THT in SIL or DIL variants
  • Dip coating, i.e. encapsulation in casing
Industrial

Substrate

  • Standard and multilayer thick film on ceramic with printed, laser-tuned resistances
  • Standard FR-4/FR-5 printed circuit boards, CEM, Starr-Flex
  • Multilayer printed circuit boards for very high wire densities
  • DCB and IMS